Research interest: Renewable Energy, Image Processing, Infrared Thermography,
Condition Monitoring, Power Electronics
M.Sc. Electric and Electronic Eng.
Universiti Sains Malaysia (USM), Penang, Malaysia.
B Eng. (Hons.) Electric and Electronics, Universiti Sains Malaysia (USM)
Penang, Malaysia.April 2000 – Jun 2000 Industrial Trainee at Motorola Sdn Bhd. as a Trainee Engineer
Sept 2002 – May 2005 Research Officer at Universiti Sains Malaysia
Aug 2005 – Apr 2006 Part time/full time lecturer at Faculty of Electrical Engineering, Universiti Teknologi Mara (UiTM) , Penang, Malaysia
Apr 2006 – June 2006 Tutor at Faculty of Electrical & Electronic Engineering, Kolej Universiti Kejuruteraan & Teknologi Malaysia (KUKTEM) , Pahang, Malaysia
June 2006 – Now Lecturer at Faculty of Electrical & Electronic Engineering, Kolej Universiti Kejuruteraan & Teknologi Malaysia (KUKTEM)/ Universiti Malaysia PAHANG (UMP), Pahang, Malaysia
Electronic Circuit Design - Pspice, Electronic workbench, OrCAD, PESIM, Eagle
Digital Circuit Design - Xilinx, VHDL, Multisim.
Hardware Programming - Intel 8085 and Intel 8051 microcontroller, PIC microcontroller, Assembly Language, Basic Langguage, Arduino
Software Programming - C & C++ programming, Matlab, ADS, Visual Basic, Borland C++ Builder, Delphi, Expert System. Image processing.
Software & Networking - Microsoft Offices, Microsoft Windows 98, XP, HTML, AutoCAD.
Power & Energy - Grid-connected PV System design (ISPQ Competence), Infrared Thermography (Certified) & Predictive and Preventive Maintenance, Condition Monitoring.
- Power Electronic
- Image Processing
Professional membership & activities:
- Member – International Association of Computer Science and Information Technology (IACSIT)
- IEEE Member (31 December 2013)
- IEEE Consumer Electronics Society - Member
- IEEE Power & Energy Society - Member
- IEEE Communications Society - Member
- Journal of Signal and Image Processing - Advisory Board Member (Membership No: DB01D0B1EE - Valid Until: 16 Mar 2016)
- International Journal of Integrated Engineering (Issue On Electrical And Electronic Engineering) Volume 3 No. 2 December 2011 ISSN : 2229-838X - Scientific Committee
- The Institute of Doctors Engineers and Scientists - Invited Member (Membership Number: 2128 - Expiration Date: 2015-01-06, Associative Network ACEEE).
- Guest Editor for Special Issue on Thermal Imaging Application in the journal of Electrical and Electronic Engineering, Scientific & Academic Publishing (http://www.sapub.org/), USA, 2014.